February 17 – 19, 2027
IC & SENSOR PACKAGING EXPO 2027
IC and Sensor Packaging Expo
Tokyo, Japan
WhenFebruary 17 – 19, 2027
IndustryPackaging & printing, Electronics & technology
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About the fair
Packaging, printing and materials, electronics, components and semiconductors.
Typical weather on these dates
Average of 2015–2024 measurements for February 17 – 19, 2027 in Tokyo — the exact days of the fair, not the whole month.
Feb 1711° / 2°
Feb 1810° / 1°
Feb 1912° / 3°rain in 30% of years
Source: NASA POWER (measurements 2015–2024), coordinates © OpenStreetMap
That same week in Tokyo
Other fairs running at the same time — worth seeing while the trip is already paid for.
February 14 – 16, 2027